Titanium Silicon Carbide (Ti3SiC2) Micron Powder, Purity: 99.5+%, Size:325 mesh

Description

Titanium Silicon Carbide (Ti₃SiC₂) Micron Powder

Titanium Silicon Carbide (Ti₃SiC₂) Micron Powder

Purity: 99.5+%
Particle Size: < 325 mesh

Product Description

Titanium Silicon Carbide (Ti₃SiC₂) is a prominent member of the MAX phase family, known for its unique nanolaminated structure that merges the desirable features of both metals and ceramics. As a ternary compound composed of titanium (Ti), silicon (Si), and carbon (C), Ti₃SiC₂ exhibits a hexagonal crystal structure (space group P6₃/mmc), where transition metal atoms form a nearly closed-packed lattice interleaved with A-group element layers and carbon atoms in octahedral positions.

This distinctive atomic architecture enables MAX phases like Ti₃SiC₂ to offer a rare combination of properties, including machinability, high electrical and thermal conductivity, lightweight, and exceptional mechanical strength at elevated temperatures. The material is especially valued for its resistance to oxidation, creep, corrosion, and thermal shock.

Key Properties

• High Purity: 99.5+% ensures consistent performance and reliability in demanding applications

• Layered Crystal Structure: Facilitates machinability and toughness, even under high thermal gradients

• Metallic Traits: Good electrical/thermal conductivity, thermal shock resistance, and damage tolerance

• Ceramic Traits: Low density, excellent oxidation resistance, and structural stability at high temperatures

• Thermal Stability: Withstands extreme heat without degradation

• Corrosion and Oxidation Resistance: Ideal for harsh environments

Applications

Ti₃SiC₂ MAX Phase powder is suitable for advanced applications that require a balance between electrical conductivity and structural integrity at elevated temperatures. Its uses include:

• High-temperature structural components

• Thermal and electrical interface materials

• Cutting tools and wear-resistant coatings

• Nuclear industry (e.g., neutron-absorbing structures)

• Aerospace and automotive components

• Electronic substrates and heat spreaders

• Energy systems (e.g., SOFCs, batteries, and supercapacitors)