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Description
Copper (Cu) Micron Powder
Purity: 99.99 %, Size: 100 mesh, Spherical
Technical Properties:
PURITY | 99.99 % |
PARTICLE SIZE | 100 mesh |
CAS | 7440-50-8 |
DENSITY | 8.94 g/cm³ |
BOILING POINT | 2595 °C |
MELTING POINT | 1083 °C |
COEFF. OF EXPANSION @ 20ºC | 16.42 x 10⁻⁶ |
MOHS HARDNESS @ 20ºC | 3 |
ELECTRIC CONDUCTANCE | 0.593 microhm-1 |
CRYSTAL STRUCTURE | Cubic, Face Centered |
FORM | Powder |
APPLICATIONS | Electronics |
Additional information
| Gram | 25 g, 1000 g, 500 g, 100 g |
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