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Description
Cubic Boron Nitride (c-BN) Nanopowder/Nanoparticles – Purity: 99.9%, Size: <200 nm
Product Overview
Cubic Boron Nitride (c-BN), also known as β-BN, is a synthetic superhard material structurally analogous to diamond. With a sphalerite-type cubic crystal structure, it is second only to diamond in hardness but demonstrates superior thermal and chemical stability, especially in ferrous applications. Unlike its hexagonal counterpart (h-BN), c-BN offers enhanced wear resistance and is insoluble in iron, nickel, and related alloys, making it the ideal abrasive for machining tough metals.
Technical Specifications
| Property | Value |
|---|---|
| Chemical Formula | BN |
| Purity | 99.9% |
| Average Particle Size | <200 nm |
| Appearance | Black Solid |
| Molecular Weight | 24.82 g/mol |
| Crystal Structure | Cubic (Sphalerite) |
| Density (c-BN) | 3.45 g/cm³ |
| Melting Point | 2973 °C |
| Solubility in Water | Insoluble |
| Refractive Index | 2.1 (c-BN) |
| Electrical Resistivity | 10¹³ – 10¹⁵ Ω·m |
| Poisson’s Ratio | 0.11 |
| Specific Heat | 840–1610 J/kg·K |
| Thermal Conductivity | 29–96 W/m·K |
| Thermal Expansion | 0.54–18 µm/m·K |
| Young’s Modulus | 14–60 GPa |
Synthesis Process
Cubic BN is synthesized by subjecting hexagonal boron nitride (h-BN) to extreme pressures (4–18 GPa) and high temperatures (1500–3230 °C), often in the presence of catalysts like lithium, magnesium, or boron oxide. Industrial-scale synthesis methods include crystal growth under thermal gradients and shock wave techniques. Thin films of c-BN are deposited using advanced methods such as plasma-enhanced chemical vapor deposition and ion beam sputtering.
Applications
Cubic Boron Nitride is extensively used in industries requiring extreme hardness, thermal conductivity, and chemical inertness:
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Abrasives & Cutting Tools: Ideal for machining hardened steels and superalloys where diamond fails due to solubility in iron.
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Heat Spreaders: Exceptional thermal conductivity combined with electrical insulation makes it ideal for electronic devices.
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X-ray Membranes: Low atomic mass and mechanical stability allow high-resolution imaging with minimal interference.
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Thin Film Coatings: c-BN films offer durability in high-friction, high-heat environments.
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High-Performance Ceramics: Used in sintered form for wear-resistant components.
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Metal Bonding Agents: Forms stable borides/nitrides at interfaces, enhancing material integrity.
Additional information
| Gram | 5 g, 25 g, 100 g, 500 g, 1000 g |
|---|