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Description
Copper-Phosphorus (Cu-P) Alloy Micron Powder Cu: 93% – P: 7% | Particle Size: −200 mesh | Irregular
Copper-Phosphorus (Cu-P) Alloy Micron Powder is a micron-sized metallic alloy powder produced by alloying copper and phosphorus in controlled proportions (93% Cu – 6–8% P). The irregular particle morphology obtained through the water-atomization process provides a high surface area, enabling effective reaction behavior and strong mechanical interlocking in sintering, brazing, and metal bonding applications. The −200 mesh particle size distribution ensures balanced flow behavior and homogeneous dispersion during processing.
Product Features
Alloy type: Copper–Phosphorus (Cu-P)
Chemical composition: 93% Cu / 6–8% P
Particle size: −200 mesh
Particle morphology: Irregular (non-spherical)
Production method: Water-atomized
Physical form: Metallic alloy powder
Apparent density: 1.50 – 3.00 g/cm³
Hydrogen loss: ~0.60%
Functional property: Deoxidizing effect
Dispersion: Homogeneous distribution in metal, binder, and filler systems
Application:
Brazing and Hard Soldering
Copper-to-copper and copper-to-steel joints
Brazing applications that reduce or eliminate the need for flux
HVAC, refrigeration, and piping systems
Powder Metallurgy and Sintering
Copper-based sintered components
Alloy additive to help reduce sintering temperatures
Production of metal matrix composites
Welding and Filler Materials
Brazing rods, pastes, and filler alloys
Industrial maintenance and repair (MRO) applications
Electrical and Electronic Applications
Electrical connection components
Conductive parts and contact manufacturing
Specialized soldering and joining systems
Defense and Industrial Applications
Technical joints requiring efficient heat transfer and sealing
Brazed and sintered subsystems
Specialized metal alloy formulations for R&D and prototyping purposes
Additional information
| Gram | 100 g, 500 g, 1000 g, 5000 g |
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