AgSinter™ High-Temperature Solderable Silver Paste

Description

AgSinter™ High-Temperature Solderable Silver Paste

• Material Type: Solderable Silver Conductive Paste

• Solid Content: 75 ± 5 wt%

• Appearance: Silver-grey paste

Rheological & Printing Properties

• Viscosity: 100 ± 20 kcps

• Fineness (50% Line Width): ≤ 5 µm

• Recommended Screen: 300–500 mesh stainless steel

Thermal Processing Parameters

• Drying Temperature: 100–130 °C

• Binder Burnout Temperature: ~350 °C

• Sintering Temperature: 850 ± 50 °C

• Compatible Furnaces: Tunnel furnace, muffle furnace

AgSinter™ High-Temperature Solderable Silver Paste is a silver-rich conductive paste engineered for applications requiring excellent electrical conductivity, strong mechanical integrity, and reliable solderability after high-temperature sintering. When processed under controlled conditions, the paste forms a dense and uniform silver layer that provides stable electrical performance and robust adhesion to ceramic and electronic substrates.

The formulation is free from lead and cadmium, supporting environmentally responsible manufacturing while maintaining industrial-grade performance. Its optimized particle distribution and binder system allow consistent screen printing, smooth surface formation, and effective binder burnout prior to sintering. After high-temperature treatment, the resulting silver layer exhibits excellent compatibility with both manual and reflow soldering processes, making it suitable for long-life electronic and energy components.

Applications

Ceramic and High-Voltage Capacitors

AgSinter™ paste is widely used to create external electrodes on ceramic capacitors, particularly for high-voltage designs. After sintering, it delivers low-resistance electrical contacts and long-term operational stability.

Printed Circuit Boards (PCBs)

Applied for conductive interconnections and trace repair on PCBs, offering strong adhesion and reliable solderability in both automated and hand-soldering operations.

Flexible and Hybrid Electronic Circuits

Supports the formation of conductive layers in hybrid modules and flexible electronic assemblies through screen printing, enabling compact layouts and process flexibility.

Solar Cell Metallization

Used in the deposition of conductive fingers and busbars on photovoltaic cells, contributing to efficient current collection and minimized resistive losses.

Sensors and Transducers

Functions as a stable electrode material in piezoelectric devices, pressure sensors, and other ceramic-based sensing elements where consistent conductivity and mechanical bonding are essential.

Automotive Electronics

Provides durable electrical connections in control units and sensor systems exposed to thermal cycling, vibration, and harsh operating environments.

LED and Lighting Components

Applied to ceramic LED packages to form solderable contact layers that maintain reflectivity, thermal stability, and integrity during reflow soldering.

Consumer Electronics Assembly

Supports bonding and interconnection in compact electronic devices, enabling high-density packaging and reliable long-term performance.