Description
Aluminum Nitride (AlN) Powder – Purity: 99.5%, Hexagonal
Aluminum Nitride (AlN) Powder is a high-performance ceramic material with exceptional thermal conductivity (up to 320 W/m·K), high electrical insulation, and excellent mechanical stability. Its hexagonal crystal structure and purity of 99.5% make it an essential material for advanced electronic packaging, thermal management, and high-temperature applications.
With a very low thermal expansion coefficient (3.5 × 10⁻⁶ K⁻¹) closely matching that of silicon, AlN is particularly valuable in the semiconductor industry, ensuring reliability and stability in integrated circuits and microelectronic devices.
Technical Properties
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Purity: 99.5%
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Crystal Structure: Hexagonal
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Average Particle Size (APS): ~1 micron
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Specific Surface Area (SSA): 3–5 m²/g
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Color: Gray
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Zeta Potential: 44.7 mV
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Thermal Conductivity: ~320 W/m·K
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Thermal Expansion Coefficient: 3.5 × 10⁻⁶ K⁻¹
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Manufacturing Method: Physical methods
Certificate of Analysis (wt%)
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N: >33
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O: <0.5
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C: <0.04
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Fe: <0.01
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Si: <0.045
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Ca: <0.009
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Cl: <0.0004
Applications
Electronics & Semiconductors
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Substrates for integrated circuit boards and electronic devices
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Electrically insulating packages with high thermal conductivity
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Wafer processing components (chucks, carriers, supports)
Thermal Management
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Heat sinks and radiators for high-power devices
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Thermally conductive filler in polymers and adhesives
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Used in metal matrix and polymer matrix composites
High-Temperature Applications
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Crucibles for metals and salt melts
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High-temperature evaporation boats
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Advanced ceramics for optical and optoelectronic devices
Composite & Specialty Materials
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Reinforcement in composite ceramics
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Electronic packaging materials requiring heat dissipation and insulation