Aluminum Nitride (AlN) Powder – Purity: 99.5%, 1 um, Hexagonal

Description

Aluminum Nitride (AlN) Powder – Purity: 99.5%, Hexagonal

Aluminum Nitride (AlN) Powder is a high-performance ceramic material with exceptional thermal conductivity (up to 320 W/m·K), high electrical insulation, and excellent mechanical stability. Its hexagonal crystal structure and purity of 99.5% make it an essential material for advanced electronic packaging, thermal management, and high-temperature applications.

With a very low thermal expansion coefficient (3.5 × 10⁻⁶ K⁻¹) closely matching that of silicon, AlN is particularly valuable in the semiconductor industry, ensuring reliability and stability in integrated circuits and microelectronic devices.

Technical Properties

• Purity: 99.5%

• Crystal Structure: Hexagonal

• Average Particle Size (APS): ~1 micron

• Specific Surface Area (SSA): 3–5 m²/g

• Color: Gray

• Zeta Potential: 44.7 mV

• Thermal Conductivity: ~320 W/m·K

• Thermal Expansion Coefficient: 3.5 × 10⁻⁶ K⁻¹

• Manufacturing Method: Physical methods

Certificate of Analysis (wt%)

• N: >33

• O: <0.5

• C: <0.04

• Fe: <0.01

• Si: <0.045

• Ca: <0.009

• Cl: <0.0004

Applications

Electronics & Semiconductors

• Substrates for integrated circuit boards and electronic devices

• Electrically insulating packages with high thermal conductivity

• Wafer processing components (chucks, carriers, supports)

Thermal Management

• Heat sinks and radiators for high-power devices

• Thermally conductive filler in polymers and adhesives

• Used in metal matrix and polymer matrix composites

High-Temperature Applications

• Crucibles for metals and salt melts

• High-temperature evaporation boats

• Advanced ceramics for optical and optoelectronic devices

Composite & Specialty Materials

• Reinforcement in composite ceramics

• Electronic packaging materials requiring heat dissipation and insulation