Description
Copper (Cu) Micron Powder
Purity: 99.5+%, Size: <5 µm, Spherical
Technical Properties:
PURITY | 99.5+% |
PARTICLE SIZE | 5 µm |
CAS | 7440-50-8 |
DENSITY | 8.94 g/cm³ |
BOILING POINT | 2595 °C |
MELTING POINT | 1083 °C |
COEFF. OF EXPANSION @ 20ºC | 16.42 x 10⁻⁶ |
MOHS HARDNESS @ 20ºC | 3 |
ELECTRIC CONDUCTANCE | 0.593 microhm-1 |
CRYSTAL STRUCTURE | Cubic, Face Centered |
FORM | Flake |
APPLICATIONS | Aerospace Alloys Colorants Electronics Inks Paints Pigments |