Copper (Cu) Micron Powder, Purity: 99.9%, Size: <5 µm, Spherical

Description

Copper (Cu) Micron Powder, Purity: 99.5+%, Size: <5 µm, Spherical

Product Description:
Copper (Cu) Micron Powder is a high-purity, fine-grade metallic powder with a particle size of less than 5 µm and a spherical morphology. With a minimum purity of 99.5+%, this powder exhibits excellent electrical and thermal conductivity, high ductility, and strong antimicrobial activity—making it a versatile material across a broad range of advanced applications.

This spherical copper powder is specifically designed for use in high-precision manufacturing, ensuring superior flowability, high packing density, and uniform dispersion in composites or coatings. Its face-centered cubic (FCC) crystal structure contributes to its high workability and adaptability in various metallurgical and functional applications.

Technical Properties:

• Purity: 99.5+%

• Particle Size: <5 µm

• Form: Spherical

• CAS Number: 7440-50-8

• Density: 8.94 g/cm³

• Melting Point: 1083 °C

• Boiling Point: 2595 °C

• Crystal Structure: Cubic, Face Centered

• Coefficient of Thermal Expansion (20°C): 16.42 × 10⁻⁶

• Mohs Hardness (20°C): 3

• Electrical Conductance: 0.593 microhm⁻¹

Key Applications:

• Electronics: Used in the fabrication of conductive inks, pastes, and solder pastes for PCBs, touchscreens, and flexible electronics. Its fine particle size and spherical shape make it ideal for additive manufacturing and laser sintering.

• Aerospace & Defense: Essential in thermal management systems, electromagnetic shielding, and high-performance alloys requiring excellent conductivity and corrosion resistance.

• Colorants & Pigments: Acts as a metallic pigment in decorative coatings, ceramics, and glass. Adds vibrant, reddish-brown tones to specialty paints and inks.

• 3D Printing & Metal Injection Molding (MIM): The spherical form allows for efficient powder bed fusion, binder jetting, and extrusion-based metal printing processes.

• Antimicrobial Surfaces: Utilized in textiles, hospital equipment, HVAC systems, and high-touch surfaces due to copper’s well-known antimicrobial action.

• Battery & Energy Storage: Integrated into lithium-ion and solid-state battery electrodes for enhanced conductivity and energy density.

• Welding and Brazing Materials: Applied in specialty fluxes and as an additive for soldering and joining alloys.

Performance Advantages:

• Spherical morphology enhances powder flow, packing density, and sintering behavior

• High surface area and purity for better reactivity and dispersion

• Non-toxic, environmentally friendly alternative to silver-based conductors

• Excellent compatibility with polymers, solvents, and resins

• Supports both low-temperature and high-temperature processing