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Description
Copper (Cu) Micron Powder, Purity: 99.99%, Size: 100 Mesh, Spherical
Product Description:
Copper (Cu) Micron Powder is a high-purity, spherical metallic powder with a mesh size of 100 and a purity level of 99.99%. Due to its exceptional electrical and thermal conductivity, corrosion resistance, and ductility, copper micron powder is widely utilized across advanced material applications. Its spherical morphology enhances flowability and packing density, making it particularly suitable for use in precision electronic components and high-performance conductive applications.
Applications:
This high-purity copper powder is primarily used in the electronics industry for manufacturing conductive inks, pastes, circuit board components, multilayer ceramic capacitors (MLCCs), and electromagnetic shielding materials. Additionally, it serves as a raw material in powder metallurgy, 3D printing (metal additive manufacturing), and sintered parts. The spherical shape also enables uniform deposition in coating technologies and enhances material uniformity in sintering or compaction processes.
Technical Properties:
| Property | Value |
|---|---|
| Purity | 99.99% |
| Particle Size | 100 Mesh |
| Form | Powder (Spherical) |
| Crystal Structure | Cubic, Face-Centered |
| CAS Number | 7440-50-8 |
| Density | 8.94 g/cm³ |
| Melting Point | 1083 °C |
| Boiling Point | 2595 °C |
| Electrical Conductance | 0.593 microhm⁻¹ |
| Thermal Expansion Coefficient | 16.42 x 10⁻⁶ |
| Mohs Hardness (at 20 °C) | 3 |
Key Features:
High purity (99.99%) for critical applications
Spherical particle shape for excellent flow and packing
Outstanding thermal and electrical conductivity
Suitable for use in high-performance electronic systems
Compatible with powder metallurgy and metal 3D printing
Additional information
| Gram | 25 g, 100 g, 500 g, 1000 g |
|---|