Copper (Cu) Micron Powder – Spherical (99.99%, 1 µm)

Description

Copper (Cu) Micron Powder – Spherical (99.99%, 1 µm)

Copper (Cu) Micron Powder is a high-purity spherical metallic powder with an average particle size of 1 µm and purity of 99.99%. Known for its exceptional electrical and thermal conductivity, corrosion resistance, and ductility, this powder is widely used across electronics, aerospace, metallurgy, pigments, and additive manufacturing.

The spherical morphology ensures superior flowability, uniform packing, and sintering behavior, making it highly suitable for powder metallurgy, conductive inks, coatings, and high-performance electronic applications. With a cubic, face-centered crystal structure (FCC) and fine micron scale, it provides both excellent performance and processability.

Technical Properties

• Chemical Symbol: Cu

• Purity: 99.99%

• Particle Size: 1 µm

• Morphology: Spherical

• CAS Number: 7440-50-8

• Density: 8.94 g/cm³

• Melting Point: 1083 °C

• Boiling Point: 2595 °C

• Coefficient of Expansion (20 °C): 16.42 × 10⁻⁶

• Mohs Hardness (20 °C): 3

• Electrical Conductivity: 0.593 µΩ⁻¹·cm⁻¹ (excellent)

• Crystal Structure: Cubic, face-centered (FCC)

• Form: Metallic spherical powder

Applications

Electronics & Conductive Materials

• Essential for conductive inks, pastes, and slurries in printed electronics.

• Used in circuit boards, conductive coatings, and connectors.

Aerospace & Alloys

• Applied in lightweight aerospace alloys for strength and conductivity.

• Integral in high-performance copper-based alloys.

Pigments, Paints & Inks

• Provides color stability and metallic luster in paints, coatings, and pigments.

Powder Metallurgy & Additive Manufacturing

• Suitable for sintered components, 3D printing, and advanced coating technologies due to its spherical morphology.

Industrial & Catalytic Uses

• Utilized in chemical catalysis, thermal management systems, and energy applications.