Description
Copper (Cu) Nanoparticles / Nanopowder (Partially Passivated, 99.8%, 25 nm)
Copper (Cu) Nanoparticles, partially passivated with oxygen (~0.8 wt% for safe shipping, no significant performance loss), are high-purity (99.8%) spherical particles with an average size of 25 nm, manufactured using advanced laser synthesis technology. These nanoparticles exhibit excellent electrical and thermal conductivity, along with high catalytic efficiency, making them suitable for a wide range of industrial, electronic, and scientific applications. Their black-brown color and uniform morphology ensure optimal dispersion and performance in various systems.
Applications
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Electronics: Conductive coatings, inks, and pastes for printed electronics, MLCC internal electrodes, and microelectronic components.
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Catalysis: High-efficiency catalysts for processes such as CO₂ hydrogenation to methanol.
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Thermal Management: High thermal conductivity materials for electronics cooling.
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Lubricants: Nano-additives for self-lubricating and anti-wear coatings in oils and greases.
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Powder Metallurgy: Raw material for copper nano-composite production in inert atmospheres.
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Medical & Functional Coatings: Antimicrobial and biocompatible conductive surfaces.
Technical Specifications
| Property | Value |
|---|---|
| Purity (Metal Basis) | 99.8% |
| Average Particle Size (APS) | 25 nm |
| Specific Surface Area (SSA) | 30–50 m²/g |
| Color | Black-brown |
| Morphology | Spherical |
| Bulk Density | 0.15–0.35 g/cm³ |
| True Density | 8.94 g/cm³ |
| Manufacturing Method | Laser Synthesized |
| Oxygen Content (Passivation) | ~0.8 wt% |
Elemental Analysis (ppm)
| Element | Content |
|---|---|
| Cu | 99.8% (Metal Basis) |
| Ag | 10 |
| Ca | 10 |
| Mn | 1 |
| Si | 1000 |
| O | 0.8 wt% |
Storage & Handling
Store in a vacuum-sealed container in a cool, dry place. Avoid exposure to air, heat, sunlight, moisture, or mechanical stress. Handle gently to prevent agglomeration and preserve nano-scale properties.