Copper (Cu) Nanopowder / Nanoparticles (99.9%, 30–70 nm, Metal Basis)

Description

Copper (Cu) Nanopowder / Nanoparticles (99.9%, 30–70 nm, Metal Basis)

Copper (Cu) Nanopowder/Nanoparticles with 99.9% purity and a particle size range of 30–70 nm delivers outstanding electrical and thermal conductivity, making it ideal for cutting-edge industrial, electronic, and research applications. With a spherical morphology and cubic crystal structure, this nanopowder provides high reactivity, excellent dispersibility, and a specific surface area of 11.0–15.0 m²/g. The warm copper-brown color indicates its high-quality production and minimal impurity levels. Each batch is vacuum-sealed to maintain stability, prevent oxidation, and ensure consistent performance.

Technical Properties

• Purity: ≥99.9% (Metal Basis)

• Particle Size: 30–70 nm (Average: 35 nm)

• Bulk Density: 0.19 g/cm³

• True Density: 8.9 g/cm³

• Color: Warm copper brown

• Shape: Spherical

• Crystal Structure: Cubic

• Specific Surface Area: 11.0–15.0 m²/g

• Elemental Analysis:

  • Cu: ≥99.9%

  • Fe: ≤0.006%

  • Ni: ≤0.005%

  • Others: ≤0.002%

Applications

• Electronics: Conductive coatings, inks, and pastes for high-performance circuits.

• Catalysis: Active catalyst for methanol synthesis and other chemical processes.

• Microelectronics: Raw material for miniaturized and high-efficiency components.

• Lubricants: Additive to reduce friction, enhance wear resistance, and extend lifespan.

• Wear-Resistant Coatings: Improves surface hardness and durability.

• Sintering Additives: Enhances bonding in powder metallurgy applications.