Description
Copper (Cu) Nanopowder / Nanoparticles (99.9%, 30–70 nm, Metal Basis)
Copper (Cu) Nanopowder/Nanoparticles with 99.9% purity and a particle size range of 30–70 nm delivers outstanding electrical and thermal conductivity, making it ideal for cutting-edge industrial, electronic, and research applications. With a spherical morphology and cubic crystal structure, this nanopowder provides high reactivity, excellent dispersibility, and a specific surface area of 11.0–15.0 m²/g. The warm copper-brown color indicates its high-quality production and minimal impurity levels. Each batch is vacuum-sealed to maintain stability, prevent oxidation, and ensure consistent performance.
Technical Properties
-
Purity: ≥99.9% (Metal Basis)
-
Particle Size: 30–70 nm (Average: 35 nm)
-
Bulk Density: 0.19 g/cm³
-
True Density: 8.9 g/cm³
-
Color: Warm copper brown
-
Shape: Spherical
-
Crystal Structure: Cubic
-
Specific Surface Area: 11.0–15.0 m²/g
-
Elemental Analysis:
-
Cu: ≥99.9%
-
Fe: ≤0.006%
-
Ni: ≤0.005%
-
Others: ≤0.002%
-
Applications
-
Electronics: Conductive coatings, inks, and pastes for high-performance circuits.
-
Catalysis: Active catalyst for methanol synthesis and other chemical processes.
-
Microelectronics: Raw material for miniaturized and high-efficiency components.
-
Lubricants: Additive to reduce friction, enhance wear resistance, and extend lifespan.
-
Wear-Resistant Coatings: Improves surface hardness and durability.
-
Sintering Additives: Enhances bonding in powder metallurgy applications.