Description
Copper (Cu) Nanopowder / Nanoparticles (99.9+%, 500 nm, Spherical)
Copper (Cu) Nanopowder / Nanoparticles with 99.9+% purity and 500 nm spherical particle size offers outstanding electrical and thermal conductivity, making it ideal for advanced industrial and electronic applications. Produced in a spherical morphology with a cubic crystal structure, these nanoparticles ensure consistent performance in high-tech manufacturing. Their reddish-brown appearance reflects the high-purity copper base, while the large particle size provides excellent stability in processing.
Applications
Electronics Industry: Conductive coatings, inks, and pastes for microelectronic devices.
Catalysis: Used as a catalyst in chemical reactions, such as methanol production from CO₂ and hydrogen.
Additive Manufacturing: Raw material for electronic components and sintering additives.
Thermal Conductivity Solutions: High-efficiency heat dissipation in advanced systems.
Lubricants: Improves anti-friction and anti-wear properties by forming self-lubricating coatings.
Wear-Resistant Coatings: Enhances durability of mechanical components.
Technical Properties
| Property | Value |
|---|---|
| Purity | 99.9+% |
| Particle Size | 500 nm |
| Shape | Spherical |
| Color | Reddish Brown |
| Crystal Structure | Cubic |
| Bulk Density | 0.7–1.1 g/cm³ |
| True Density | 8.9 g/cm³ |
| Specific Surface Area | 4.6 m²/g |
Elemental Analysis (%)
Cu: ≥99.95
Fe: ≤0.02
Ni: ≤0.01
Others: ≤0.01
Storage & Handling
Store in a vacuum-sealed container in a cool, dry environment.
Avoid exposure to moisture, heat, sunlight, and air.
Handle gently to prevent particle aggregation.
Keep away from sources of ignition due to flammability.