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Description
Copper (Cu) Nanopowder / Nanoparticles – 99.9+% Purity, 100 nm, Spherical
Copper (Cu) Nanopowder / Nanoparticles are high-purity (99.9+%) spherical particles with an average size of 100 nm, designed for excellent electrical and thermal conductivity. With a warm copper-brown color, cubic crystal structure, and a specific surface area of 5.0–5.8 m²/g, these nanoparticles are optimized for high-performance industrial and research applications.
Produced to extremely low impurity levels (Fe ≤ 0.006%, Ni ≤ 0.005%), Copper Nanoparticles are widely used in electronics manufacturing, conductive inks, coatings, catalysts, and wear-resistant materials.
Applications
Electronics Industry – Conductive coatings, inks, and pastes for PCBs and microcircuits
Microelectronic Devices – Advanced semiconductor and interconnect manufacturing
Catalysis – Methanol production and chemical reaction enhancement
Lubricant Additives – Reduced friction and enhanced wear resistance
Wear-Resistant Coatings – Surface protection in industrial equipment
Sintering Additives – Improved densification in powder metallurgy
Technical Specifications
| Property | Value |
|---|---|
| Purity | ≥ 99.9% (metal basis) |
| Average Particle Size (APS) | 100 nm |
| Shape | Spherical |
| Color | Warm copper brown |
| Crystal Structure | Cubic |
| Bulk Density | 0.22 g/cm³ |
| True Density | 8.9 g/cm³ |
| Specific Surface Area (SSA) | 5.0–5.8 m²/g |
| Elemental Analysis | Cu ≥ 99.9%, Fe ≤ 0.006%, Ni ≤ 0.005%, Others ≤ 0.002% |
Storage Conditions
Store in vacuum-sealed containers in a cool, dry place.
Avoid sunlight, heat sources, and moisture.
Prevent exposure to air to avoid oxidation and particle coagulation.
Additional information
| Gram | 25 g, 100 g, 500 g, 1000 g |
|---|