Description
Copper (Cu) Nanopowder / Nanoparticles (99.95%, 80–240 nm, Metal Basis)
Copper (Cu) Nanopowder/Nanoparticles (99.95% purity, 80–240 nm, metal basis) is a high-purity, spherical nanopowder with a reddish-brown appearance. With its cubic crystal structure and exceptional electrical and thermal conductivity, it is widely used in electronics, catalysis, and advanced manufacturing. This copper nanopowder is produced under strict quality control, ensuring uniform particle size distribution and high performance. Due to its highly reactive and flammable nature, it must be stored in vacuum-sealed containers, away from moisture, sunlight, and heat, to prevent oxidation and particle agglomeration.
Its unique nanoscale properties make it ideal for use in conductive coatings, microelectronics, catalytic processes, wear-resistant coatings, lubricants, and sintering applications. The product’s high purity ensures optimal performance in industrial, research, and development projects.
Applications:
Conductive Coatings, Inks & Pastes: Enhances electrical conductivity for electronic circuits and PCB manufacturing.
Microelectronics: Used in high-performance electronic components and miniaturized devices.
Catalysis: Effective catalyst in chemical reactions such as methanol production.
Lubricant Additive: Improves anti-friction and wear resistance in mechanical systems.
Wear-Resistant Coatings: Provides durability in industrial machinery and tools.
Sintering Additives: Improves density, conductivity, and strength of sintered products.
Technical Properties:
| Property | Value |
|---|---|
| Purity (%) | 99.95 |
| Particle Size (nm) | 80–240 |
| Average Particle Size (nm) | 80–240 |
| Bulk Density (g/cm³) | 0.25 |
| True Density (g/cm³) | 8.9 |
| Color | Reddish Brown |
| Shape | Spherical |
| Crystal Structure | Cubic |
| Specific Surface Area (m²/g) | 4.6 |
| Elemental Analysis (%) | Cu ≥99.95, Fe ≤0.02, Ni ≤0.01, Others ≤0.01 |