Description
Copper (Cu) Powder (99.5%, 800 nm, Metal Basis)
Copper (Cu) Powder, with a purity of 99.5% (metal basis) and an average particle size of 800 nm, is a high-quality, super fine grade metallic powder. It appears as a red-brown, near-spherical powder with excellent electrical and thermal conductivity. With a specific surface area of 2 m²/g and a true density of 8.9 g/cm³, this material is ideal for advanced manufacturing and industrial applications. Copper powder’s unique combination of high conductivity, catalytic properties, and chemical stability makes it suitable for electronics, energy systems, and precision metallurgy.
Applications
Electronics & Electrical Conductivity – Used in conductive coatings, conductive inks, and pastes for printed electronics.
Microelectronics Manufacturing – Suitable for MLCC internal electrodes and electronic slurry production to enable miniaturization of components.
Catalysis – Acts as an efficient catalyst for chemical reactions such as CO₂ hydrogenation to produce methanol.
Capacitor & Energy Storage Materials – Employed in capacitor manufacturing and as a raw material for bulk nanocomposites.
Metal Coatings – Used for surface conductive coating processing of metals and non-ferrous metals.
Lubricant Additives – Adding 0.1–0.6% copper powder to lubricants forms a self-lubricating, self-repairing coating to reduce friction and wear.
Powder Metallurgy – Applied in the fabrication of high-performance copper composite materials.
Technical Specifications
| Property | Value |
|---|---|
| Purity (metal basis) | 99.5% |
| Average Particle Size (APS) | 800 nm (Super fine grade) |
| Color | Red-brown |
| Morphology | Near spherical |
| Specific Surface Area (SSA) | 2 m²/g |
| True Density | 8.9 g/cm³ |
| Impurities (max, ppm) | As <10, Cd <10, Hg <10, Pb <10, Ni <90, Fe <170, Sn <30, Sb <10, Mn <47, Zn <54 |
Storage Conditions
Store in a vacuum-sealed container in a cool, dry environment. Avoid exposure to air, moisture, heat, sunlight, vibration, and impact to prevent oxidation and particle aggregation.