Description
Copper-Phosphorus (Cu-P) Alloy Micron Powder Cu: 86% – P: 14% | Particle Size: −200 mesh | Irregular
Copper-Phosphorus (Cu-P) Alloy Micron Powder is a micron-sized metallic alloy powder produced by alloying copper and phosphorus in controlled proportions (86% Cu – 14% P). The irregular particle morphology obtained through the water-atomization process provides a high surface area, enabling strong mechanical interlocking and efficient reaction behavior in sintering, brazing, and metal bonding applications. The product is widely used in technical and industrial processes due to its deoxidizing effect and its ability to enhance joint quality.
Product Features
Alloy type: Copper–Phosphorus (Cu-P)
Chemical composition: 86% Cu / 14% P
Particle size: −200 mesh
Particle morphology: Irregular (non-spherical)
Production method: Water-atomized
Physical form: Metallic alloy powder
Apparent density: ~2.25 – 3.00 g/cm³
Sintering behavior: Improved densification and bonding performance
Functional property: Deoxidizing effect
Dispersion: Homogeneous distribution in metal, binder, and filler systems
Application:
Brazing and Hard Soldering
Copper-to-copper and copper-to-steel joints
Brazing applications that reduce or eliminate the need for flux
HVAC, refrigeration, and piping systems
Powder Metallurgy and Sintering
Copper- and bronze-based sintered components
Alloy additive to help reduce sintering temperatures
Production of metal matrix composites
Welding and Filler Materials
Brazing rods, pastes, and filler alloys
Industrial maintenance and repair (MRO) applications
Electrical and Electronic Applications
Electrical connection components
Conductive parts and contact manufacturing
Specialized soldering and joining systems
Defense and Industrial Applications
Technical joints requiring efficient heat transfer and sealing
Brazed and sintered subsystems used in defense industry applications
Specialized metal alloy formulations for R&D and prototyping purposes

