FlexiBond™ Low-Temp Silver Conductive Adhesive Paste

Description

FlexiBond™ Low-Temp Silver Conductive Adhesive Paste

• Material Type: Silver-Filled Conductive Adhesive

• Binder System: Epoxy-Based

• Appearance: Silver Grey Paste

Electrical & Mechanical Properties

• Sheet Resistance: ≤ 30 mΩ/□

• Viscosity: 11 – 30 Pa·s

• Hardness: ≥ 2

• Bending Endurance: ≥ 6 cycles

• Adhesion: No shedding after curing

Processing Parameters

• Curing Temperature: 80 – 120 °C

• Curing Time: ≤ 30 minutes

• Recommended Thinner: DBE

• Recommended Cleaner: Cyclohexanone

  FlexiBond™ Low-Temp Silver Conductive Adhesive Paste is a silver-filled, epoxy-based conductive adhesive engineered for reliable electrical interconnection and mechanical bonding in compact and delicate electronic assemblies. The formulation is optimized to deliver excellent electrical conductivity while maintaining strong adhesion and mechanical durability, even under dynamic stress conditions.

  Designed for low-temperature processing, this adhesive cures efficiently at moderate temperatures, making it particularly suitable for heat-sensitive substrates and thin-film structures. After curing, it forms a stable, non-shedding bond with consistent hardness and flexibility, ensuring long-term performance in applications exposed to thermal cycling, vibration, or repeated bending. Its balanced rheology also supports precise dispensing and controlled bonding in high-density electronic architectures.

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  Applications

  Display Modules and Touch Panels

  Widely used in the assembly of smartphone, tablet, and advanced display components, where dependable conductive bonding is required to endure daily mechanical stress and compact integration.

  Flexible and Printed Electronics

  Applied in PET- and polyimide-based flexible circuits, maintaining electrical continuity and adhesion during repeated bending and dynamic operation.

  Photovoltaic Devices

  Utilized for internal and backside electrode bonding in solar cells, offering stable electrical contact and resistance to humidity and thermal exposure.

  Consumer and Portable Electronics

  Functions as a high-performance interconnect in compact electronic hardware, providing impact resistance and stable signal transmission without the need for soldering.

  LED Packaging and Module Assembly

  Serves as a conductive and adhesive interface in LED assemblies, acting as a low-temperature alternative to conventional solder processes.

  Sensor and Precision Device Manufacturing

  Ideal for attaching electrodes and sensing elements in devices that require accurate conductivity, fine patterning, and gentle thermal processing.

  EMI / RFI Mitigation

  Used to bond conductive components and shielding elements, helping reduce electromagnetic and radio-frequency interference in sensitive electronic systems.

  SEM IMAGE