Description
FlexiCarbon™ Conductive Ink (Low-Temp Cure, Inkjet Grade)
Material Type: Conductive Carbon-Based Ink
Deposition Method: Inkjet Printing
Color: Black
Compatible Substrates: PET, PI, TPU, Paper
Electrical & Processing Properties
Sheet Resistance: < 3 kΩ/sqr @ 2–3 µm
Typical Sheet Resistance: ~2655 Ω/sq
Film Thickness: 2–3 µm
Viscosity (Uncured): ~0.005 Pa·s (5 cP) @ 50 s⁻¹
Curing Conditions: Approx. 3 hours at 100–180 °C
FlexiCarbon™ Conductive Ink is a low-viscosity, inkjet-compatible conductive formulation developed for precision printing of electrically functional patterns on flexible and lightweight substrates. Its carefully tuned rheology enables stable jetting behavior and uniform thin-film formation, supporting high-resolution printed electronics without clogging or spreading issues.
After curing within a moderate temperature window, the ink forms a continuous conductive layer with reliable sheet resistance while preserving mechanical flexibility. Strong adhesion and chemical stability on polymeric and paper-based substrates allow the ink to withstand bending, handling, and post-processing steps commonly encountered in flexible circuit manufacturing. These characteristics make it a practical solution for scalable printed electronics, prototyping, and laboratory-scale production.
Applications
Printed and Flexible Electronics
FlexiCarbon™ ink is well suited for producing conductive traces and patterns in flexible electronic circuits, supporting roll-to-roll and digital printing workflows.
RFID, NFC, and Antenna Structures
The ink enables fabrication of lightweight conductive antennas and interconnects for RFID and NFC systems, where uniform conductivity and substrate compatibility are critical.
Sensors and Biosensors
Used as an electrode material in chemical, biological, and physical sensors, providing consistent signal transmission and mechanical compliance for flexible sensing platforms.
Printed Heating Elements
Applicable in thin, printed heater designs that require controlled electrical resistance and stable performance across repeated thermal cycles.
EMI / RFI Shielding Layers
Forms conductive coatings that help attenuate electromagnetic and radio-frequency interference on flexible or nontraditional substrates.
Photovoltaic and Energy Devices
Can be employed in printed photovoltaic architectures and auxiliary conductive layers that benefit from low-temperature processing.
Smart Labels, Wearables, and Touch Interfaces
Ideal for smart tags, wearable electronics, and touch-sensitive components where bendability, adhesion, and fine patterning are required.

