Nickel (Ni) Micron Powder – Spherical (99.5+%, 10–35 µm)

Description

Nickel (Ni) Micron Powder – Spherical (99.5+%, 10–35 µm)

Nickel (Ni) Micron Powder is a spherical, high-purity metallic powder with a particle size of 10–35 µm and a purity of 99.5+%. Its uniform morphology, high thermal and electrical conductivity, corrosion resistance, and mechanical stability make it highly versatile for use across aerospace, electronics, additive manufacturing, energy storage, and advanced composites.

The spherical particle shape ensures excellent flowability, packing density, and sintering performance, making it ideal for powder metallurgy, conductive coatings, and 3D printing feedstocks.

Technical Properties

• Chemical Symbol: Ni

• Purity: 99.5+%

• Particle Size: 10–35 µm

• CAS Number: 7440-02-0

• Density: 8.908 g/cm³

• Melting Point: 1453 °C

• Boiling Point: 2730 °C

• Brinell Hardness: 75 (Annealed)

• Coefficient of Expansion (20 °C): 13.3 × 10⁻⁶

• Electrical Resistivity: 6.844 µΩ·cm

• Color: Gray

• Morphology: Spherical

• Form: Metallic powder

• Elemental Analysis (%): C ≤ 0.5, O ≤ 0.5

Applications

Alloys & Metal Matrix Composites

• Enhances mechanical strength, wear resistance, and corrosion resistance in aerospace, automotive, and structural alloys.

Electronics & EMI Shielding

• Used in conductive pastes, coatings, and shielding materials for printed circuit boards, sensors, and EMC protection layers.

Thermal Interface Materials

• Improves thermal conductivity in greases, gap fillers, and pads for LEDs, CPUs, and power modules.

Energy Storage & Fuel Cells

• Applied as an electrode additive in lithium-ion batteries and supercapacitors.

• Used in catalysis and hydrogen generation due to its high surface activity.

Additive Manufacturing

• Suitable as a feedstock for selective laser sintering (SLS) and binder jetting.

• Provides uniform sintering, high density, and consistent microstructure in printed parts.

Advanced Composites

• Incorporated into polymers and ceramics to improve electrical conductivity, thermal stability, and toughness in sensors, wearables, and structural applications.