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Description

Silver Conductive Adhesive Paste

Average Grain Size: 5–10 µm  Specific Surface Area (SSA): 0.5 m²/g

Our Silver Conductive Adhesive Paste is a high-performance material designed for advanced electronic applications. With a fine particle size distribution (5–10 µm) and ultra-high silver purity (>99.95%), this paste exhibits exceptional electrical conductivity, thermal durability, and mechanical resilience.

It is widely adopted in smart devices, solar cell technology, gas sensors, and printed electronics, offering reliable adhesion and long-term performance even under harsh environmental conditions such as high humidity or chemical exposure.


Technical Properties

PropertyValue
Average Grain Size5–10 µm
Apparent Density2 g/cm³
Tap Density3 g/cm³
Specific Surface Area (SSA)0.5 m²/g
Loss on Ignition (540 °C, 1hr)≤ 0.60%
Silver Content (540 °C Burn Test)> 99.95%
ColorSilver/Gray Paste
FormViscous paste

Applications

Silver Conductive Adhesive Paste is engineered for a variety of industrial and electronic uses, including:

  • Conductive Layer Applications
    Used as a conductive medium in flexible circuits and printed electronics.

  • Solar Cell Technology
    Applied on the backside of solar cells for high-efficiency power transfer and durability.

  • Inner Electrodes for Sensors
    Enables precise signal transmission in gas sensors and microelectronic components.

  • Damp-Heat & Chemical Resistance
    Performs reliably in harsh environments, including high humidity and chemical exposure.

  • Consumer Electronics
    Integrated in smart devices, displays, and home electronics for circuit bonding and EMI shielding.

Additional information

Gram

25 g, 100 g, 500 g, 1000 g