Description
Tellurium Dioxide (TeO₂) Micron Powder, Purity: 99.5+ %, Size: 1–5 µm
Product Description:
Tellurium Dioxide (TeO₂) Micron Powder is a high-purity inorganic compound with 99.95% purity and 1–5 µm particle size, widely used in optics, electronics, and acousto-optic applications. It is a white crystalline powder with an orthorhombic crystal structure, high refractive index (n ≈ 2.24), and notable thermal and chemical stability, making it suitable for precision components and advanced research.
TeO₂ is especially valued for its transparency in the infrared to visible spectrum and its strong acousto-optic coefficient, enabling its application in optical modulators, frequency shifters, and Bragg cells. The powder form allows easy dispersion in ceramic matrices, polymer films, or glass composites for both optical and electronic innovations.
Technical Properties:
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Chemical Formula: TeO₂
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Purity: 99.95%
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Particle Size: 1–5 µm
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CAS Number: 7446-07-3
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Density: 5.67 g/cm³
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Melting Point: 733 °C
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Boiling Point: 1245 °C
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Crystal Structure: Orthorhombic
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Refractive Index: 2.24
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Form: Micronized powder
Key Applications:
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Acousto-Optic Devices: Used in Bragg cells, frequency shifters, Q-switches, and modulators due to its high acousto-optic figure of merit.
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Nonlinear Optics & Photonics: Serves in nonlinear optical components and specialized laser systems.
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Infrared and Optical Glass: TeO₂ is added to glass compositions to enhance refractive index and infrared transparency.
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Piezoelectric & Electro-Optical Materials: TeO₂ is incorporated in devices requiring precise wave modulation and signal control.
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Semiconductor Industry: Acts as a precursor for tellurium-based materials and thin films.
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Catalyst Support & Chemical Research: Used in catalyst systems and experimental chemistry for its unique electronic and structural properties.
Tellurium Dioxide Micron Powder is an essential material for cutting-edge applications where high optical clarity, thermal stability, and precise structural characteristics are required. Its fine particle size allows seamless integration into advanced fabrication processes and thin-film systems.