ThermaLink™ Mild-Cure Silver Conductive Adhesive

Description

ThermaLink™ Mild-Cure Silver Conductive Adhesive

• Material Type: Silver-Filled Conductive Adhesive

• Solid Content: ~70 wt%

• Appearance: Silver-grey paste

Thermal & Electrical Properties

• Volume Resistivity: ~0.002 Ω·cm

• Thermal Conductivity: ~2.5 W/m·K

• Working Temperature Range: −50 °C to +150 °C

• Decomposition Temperature: ~200 °C

• Glass Transition Temperature (Tg): ~55 °C

Mechanical Properties

• Shear Strength: > 3 MPa

• Impact Resistance: > 6 kg / 5000 Pa

Processing Parameters

• Viscosity: 6000–9000 cP (25 °C, 10 rpm)

• Surface Curing Conditions:

  • 60–100 °C for 20–40 minutes

  • Room temperature for 2–5 hours

ThermaLink™ Mild-Cure Silver Conductive Adhesive is a high-performance, silver-filled conductive bonding material developed for precision electronic packaging and interconnect applications. Its formulation combines low electrical resistivity with strong mechanical integrity, enabling reliable signal transmission and durable bonding in compact and sensitive electronic assemblies.

The adhesive is engineered with a controlled rheological profile that supports accurate dispensing and uniform bond-line formation, minimizing voids and defects. A key advantage of this material is its gentle curing behavior: it can achieve effective surface curing at moderate temperatures or even at ambient conditions, making it highly suitable for temperature-sensitive substrates and delicate semiconductor components. Once cured, it maintains stable performance under thermal cycling and mechanical stress, offering a dependable long-term solution for advanced electronic systems.

Applications

Electronics Assembly and Packaging

Used as an alternative to conventional soldering for joining electronic components, particularly where high-temperature processes could damage sensitive parts or substrates.

Flexible and Printed Electronics

Applied for bonding conductive tracks and components on flexible materials such as PET and polyimide, preserving electrical continuity without compromising mechanical flexibility.

Telecommunications and Aerospace Systems

Utilized in EMI/RFI mitigation by bonding conductive elements or shielding structures, helping reduce electromagnetic interference in high-frequency and mission-critical circuits.

Optoelectronics and LED Modules

Serves as both an electrical and mechanical interface in LED and optoelectronic assemblies, supporting stable current flow and effective thermal dissipation.

Sensor and Precision Instrumentation

Ideal for attaching electrodes and sensing elements in precision devices that demand consistent conductivity, mechanical robustness, and mild processing conditions.

PCB Repair and Maintenance

Enables rapid and reliable restoration of electrical connections on printed circuit boards without exposing components to excessive thermal stress.