Description
Copper (Cu) Nanopowder / Nanoparticles – 99.9+% Purity, 50 nm, Spherical
Copper (Cu) Nanopowder / Nanoparticles are high-purity (99.9+%) spherical particles with an average size of 50 nm. Exhibiting a warm copper-brown color and cubic crystal structure, these nanoparticles are engineered for excellent electrical and thermal conductivity, making them ideal for advanced electronics, coatings, and catalytic applications.
With a specific surface area of 6.5–7.5 m²/g and a bulk density of 0.22 g/cm³, they offer exceptional reactivity, enabling enhanced performance in conductive inks, microelectronics, catalysts, and wear-resistant coatings.
Produced with precision to minimize impurities (Fe ≤ 0.006%, Ni ≤ 0.005%), these copper nanoparticles deliver consistent quality for both research and industrial manufacturing.
Applications
Electronics Industry – Conductive inks, coatings, and pastes for printed circuit boards
Microelectronic Devices – Advanced semiconductor components
Catalysis – Methanol production and other chemical reactions
Lubricant Additives – Friction reduction and wear resistance
Wear-Resistant Coatings – High-performance protective surfaces
Sintering Additives – Improved densification in powder metallurgy
Technical Specifications
| Property | Value |
|---|---|
| Purity | ≥ 99.9% (metal basis) |
| Average Particle Size (APS) | 50 nm |
| Shape | Spherical |
| Color | Warm copper brown |
| Crystal Structure | Cubic |
| Bulk Density | 0.22 g/cm³ |
| True Density | 8.9 g/cm³ |
| Specific Surface Area (SSA) | 6.5–7.5 m²/g |
| Elemental Analysis | Cu ≥ 99.9%, Fe ≤ 0.006%, Ni ≤ 0.005%, Others ≤ 0.002% |
Storage Conditions
Store in a vacuum-sealed container, in a cool, dry place.
Avoid exposure to sunlight, moisture, and heat.
Protect from vibration, impact, and air contact to prevent oxidation and particle coagulation.