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Description
Silver Conductive Adhesive Paste
Average Grain Size: 5–10 µm Specific Surface Area (SSA): 0.5 m²/g
Our Silver Conductive Adhesive Paste is a high-performance material designed for advanced electronic applications. With a fine particle size distribution (5–10 µm) and ultra-high silver purity (>99.95%), this paste exhibits exceptional electrical conductivity, thermal durability, and mechanical resilience.
It is widely adopted in smart devices, solar cell technology, gas sensors, and printed electronics, offering reliable adhesion and long-term performance even under harsh environmental conditions such as high humidity or chemical exposure.
Technical Properties
| Property | Value |
|---|---|
| Average Grain Size | 5–10 µm |
| Apparent Density | 2 g/cm³ |
| Tap Density | 3 g/cm³ |
| Specific Surface Area (SSA) | 0.5 m²/g |
| Loss on Ignition (540 °C, 1hr) | ≤ 0.60% |
| Silver Content (540 °C Burn Test) | > 99.95% |
| Color | Silver/Gray Paste |
| Form | Viscous paste |
Applications
Silver Conductive Adhesive Paste is engineered for a variety of industrial and electronic uses, including:
-
Conductive Layer Applications
Used as a conductive medium in flexible circuits and printed electronics. -
Solar Cell Technology
Applied on the backside of solar cells for high-efficiency power transfer and durability. -
Inner Electrodes for Sensors
Enables precise signal transmission in gas sensors and microelectronic components. -
Damp-Heat & Chemical Resistance
Performs reliably in harsh environments, including high humidity and chemical exposure. -
Consumer Electronics
Integrated in smart devices, displays, and home electronics for circuit bonding and EMI shielding.
Additional information
| Gram | 25 g, 100 g, 500 g, 1000 g |
|---|